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T/M YÖNTEMİYLE ÜRETİLMİŞ Ni-Ti-Cu KOMPOZİTLERİNİN DİFÜZYON KAYNAĞINDA SICAKLIK, SÜRE VE ARATABAKANIN BİNDİRME KAYMA TEST DEĞERLERİNE ETKİSİNİN İSTATİSTİĞE GÖRE İNCELENMESİ
THE INVESTIGATION OF LAP-SHEAR TEST VALUES IN TERMS OF TEMPERATURE, DURATION AND INTERLAYER ON THE DIFFUSION BONDING OF Ni-Ti-Cu COMPOSITES MANUFACTURED BY P/M METHOD ACCORDING TO STATISTICS

Mustafa TAŞKIN , Haluk KEJANLI

Ni-Ti-Cu, T/M, Difüzyon Kaynağı, Bindirme-Kayma, MANOVA,
Ni-Ti-Cu, P/M, Diffusion Bonding, Lap-Shear, MANOVA,

Technological Applied Sciences, Year : 2009, Volume : 4, Issue : 2, Published Date : 1.04.2009